Currently on engineering machines, the performance of this processor can equal the Snapdragon 810, and the power consumption is quite advantageous, but it is not optimistic. After all, the Snapdragon 810 is too powerful.

In terms of design level, Taibai Semiconductor lags far behind Qualcomm and Apple. It uses a leading-generation process and violently stacks performance, but it is still not as good as Qualcomm's Snapdragon 810 last year;

Naturally, it is even worse than Apple, but now Apple's A-series processors' lead over Qualcomm is not that big. The Snapdragon 810 was launched at the beginning of this year, and its ultimate performance has exceeded last year's Apple A8.

Although the power consumption drop is too exaggerated, it is not as miserable as the extreme performance that will be "far behind" a few years later.

In the next few years, Qualcomm will be "filling the hole" for the Snapdragon 810. It was not until the launch of the first-generation Snapdragon 835 in 2017 that the hole was filled. Xiaomi Mi 6 can become a "nail house" because of this processor.

without.

In the same year, Apple and iphoneX were released.

The A-series processor that year was the A11. Two years later, the Snapdragon 855 and Kirin 990 caught up.

Then it was quickly left behind by the A12 (iPhone

As for Huawei, in 2019 the Kirin 990 caught up with the Apple A11 in 2017, and the 2020 Kirin 9000 finally became brilliant, barely touching the butt of last year’s Apple A13, and beating Qualcomm Snapdragon 888 and 8Gen1 for two years. Unfortunately, that has already happened.

It’s the “Qilin’s last song”.

When Kirin is resurrected in 2023, the gap will be so large that Huawei alone can no longer catch up with it. It will require the joint efforts of the entire domestic industry chain.

The overall performance of Taibaijia 5 can surpass last year's Apple A8, and Wei Qingfan is already very satisfied.

Unfortunately, the consequence of violent stacking performance is that power consumption is difficult to suppress. Fortunately, TSMC's 16nm process is very powerful, otherwise it will most likely end up with "fire armor".

At the same time, this is our own processor, which is more convenient and smooth to adjust.

"If it doesn't work, just use heat dissipation."

In the conference room, after everyone discussed for a long time, it was Wei Qingfan who made the final decision, "The battery capacity must not be reduced. First increase the thickness, do a good job of heat dissipation, and ensure smooth flow. Anyway, our mobile phones are big and wide, so a little thicker is fine."
Chapter completed!